Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Performance and testing of thermal interface materials

The increasing power and reduced die size of CPUs used in computers increases a need for significantly improved thermal interface materials (TIM). The TIM is used to reduce contact resistance at the CPU-heat sink interface. This work provides a state-of-the-art assessment on “thermal interface materials,” including fundamentals, materials used, their performance, and how interface resistance is...

Composite Materials for Thermal Energy Storage: Enhancing Performance through Microstructures

Chemical incompatibility and low thermal conductivity issues of molten-salt-based thermal energy storage materials can be addressed by using microstructured composites. Using a eutectic mixture of lithium and sodium carbonates as molten salt, magnesium oxide as supporting material, and graphite as thermal conductivity enhancer, the microstructural development, chemical compatibility, thermal st...

High-Performance Thermal Interface Material Based on Few-Layer Graphene Composite

We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG) composite, where FLG was prepared by the interlayer catalytic exfoliation (ICE) method. We experimentally demonstrated the feasibility of FLG composites as TIMs by investigating their thermal and mechanical properties and reliability. We measured the thermal interface resistance (Rint) between F...

A metallization and bonding approach for high performance carbon nanotube thermal interface materials.

A method has been developed to create vertically aligned carbon nanotube (VACNT) thermal interface materials that can be attached to a variety of metallized surfaces. VACNT films were grown on Si substrates using standard CVD processing followed by metallization using Ti/Au. The coated CNTs were then bonded to metallized substrates at 220 °C. By reducing the adhesion of the VACNTs to the growth...